Inventor
Lee Juik
KR11 patents
Patents
11 patentsUS11362053B2Jun 14, 2022
Semiconductor chip formed using a cover insulation layer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD7 citations83
US10600791B2Mar 24, 2020
Semiconductor memory device
SAMSUNG ELECTRONICS CO LTD4 citations72
US12040231B2Jul 16, 2024
Semiconductor device including TSV and multiple insulating layers
SAMSUNG ELECTRONICS CO LTD2 citations71
US11769742B2Sep 26, 2023
Semiconductor chip and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD2 citations70
US11616018B2Mar 28, 2023
Semiconductor devices including a thick metal layer
SAMSUNG ELECTRONICS CO LTD0 citations60
US11133253B2Sep 28, 2021
Semiconductor devices including a thick metal layer
SAMSUNG ELECTRONICS CO LTD1 citations60
US12288734B2Apr 29, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations51
US12347747B2Jul 1, 2025
Semiconductor devices including a through-hole electrode
SAMSUNG ELECTRONICS CO LTD0 citations50
US12159859B2Dec 3, 2024
Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip
SAMSUNG ELECTRONICS CO LTD0 citations50
US10332842B2Jun 25, 2019
Semiconductor devices with alignment keys
SAMSUNG ELECTRONICS CO LTD0 citations49
US10026694B2Jul 17, 2018
Semiconductor devices with alignment keys
SAMSUNG ELECTRONICS CO LTD1 citations49