Inventor
KIUCHI ETSUO
JP15 patents
⚠️ This page may combine multiple inventors who share the name “KIUCHI ETSUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU HANDOTAI KK
12 patentsUS5269285ADec 14, 1993
Wire saw and slicing method using the same
SHINETSU HANDOTAI KK64 citations96
US6221814B1Apr 24, 2001
Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid
SHINETSU HANDOTAI KK106 citations95
US6827638B2Dec 7, 2004
Polishing device and method
SHINETSU HANDOTAI KK19 citations92
US5937844AAug 17, 1999
Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing
SHINETSU HANDOTAI KK47 citations92
US5875769AMar 2, 1999
Method of slicing semiconductor single crystal ingot
SHINETSU HANDOTAI KK46 citations92
US5839425ANov 24, 1998
Method for cutting a workpiece with a wire saw
SHINETSU HANDOTAI KK21 citations91
US5715807AFeb 10, 1998
Wire saw
SHINETSU HANDOTAI KK20 citations91
US5575189ANov 19, 1996
Roller having grooves for wire saw
SHINETSU HANDOTAI KK20 citations91
US6001265ADec 14, 1999
Recovery of coolant and abrasive grains used in slicing semiconductor wafers
SHINETSU HANDOTAI KK48 citations88
US5927131AJul 27, 1999
Method of manufacturing wire for use in a wire saw and wire for use in a wire saw
SHINETSU HANDOTAI KK17 citations84
US5907988AJun 1, 1999
Wire saw apparatus
SHINETSU HANDOTAI KK18 citations83
US5693596ADec 2, 1997
Cutting fluid, method for production thereof, and method for cutting ingot
SHINETSU HANDOTAI KK15 citations72