Inventor
RAZU DAVID
US14 patents
⚠️ This page may combine multiple inventors who share the name “RAZU DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
AMKOR TECHNOLOGY INC
11 patentsUS8710649B1Apr 29, 2014
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC47 citations99
US7932595B1Apr 26, 2011
Electronic component package comprising fan-out traces
AMKOR TECHNOLOGY INC66 citations99
US7714431B1May 11, 2010
Electronic component package comprising fan-out and fan-in traces
AMKOR TECHNOLOGY INC98 citations99
US7192807B1Mar 20, 2007
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC139 citations99
US6905914B1Jun 14, 2005
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC117 citations99
US9406645B1Aug 2, 2016
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC40 citations98
US8691632B1Apr 8, 2014
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC8 citations92
US9871015B1Jan 16, 2018
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC2 citations84
US9054117B1Jun 9, 2015
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC3 citations74
US10665567B1May 26, 2020
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC0 citations63
US8952522B1Feb 10, 2015
Wafer level package and fabrication method
AMKOR TECHNOLOGY INC1 citations63
HUEMOELLER RONALD PATRICK
3 patentsUS8486764B1Jul 16, 2013
Wafer level package and fabrication method
HUEMOELLER RONALD PATRICK9 citations92
US8298866B1Oct 30, 2012
Wafer level package and fabrication method
HUEMOELLER RONALD PATRICK16 citations92
US8119455B1Feb 21, 2012
Wafer level package fabrication method
HUEMOELLER RONALD PATRICK15 citations92