Inventor
NISHIO KIMITAKA
JP3 patents
Patents
3 patentsUS6716674B2Apr 6, 2004
Method of forming a semiconductor package
TEXAS INSTRUMENTS INC10 citations70
US6969919B2Nov 29, 2005
Semiconductor package production method and semiconductor package
TEXAS INSTRUMENTS INC1 citations59
US6774496B2Aug 10, 2004
Semiconductor package with a thermoset bond
TEXAS INSTRUMENTS INC2 citations59