Inventor
ZIAD HOCINE BOUZID
BE5 patents
⚠️ This page may combine multiple inventors who share the name “ZIAD HOCINE BOUZID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND
3 patentsUS7947592B2May 24, 2011
Thick metal interconnect with metal pad caps at selective sites and process for making the same
SEMICONDUCTOR COMPONENTS IND7 citations82
US7800239B2Sep 21, 2010
Thick metal interconnect with metal pad caps at selective sites and process for making the same
SEMICONDUCTOR COMPONENTS IND10 citations82
US9245736B2Jan 26, 2016
Process of forming a semiconductor wafer
SEMICONDUCTOR COMPONENTS IND6 citations81
SEMICONDUCTOR COMPONENTS IND LLC
2 patentsUS10068791B2Sep 4, 2018
Wafer susceptor for forming a semiconductor device and method therefor
SEMICONDUCTOR COMPONENTS IND LLC8 citations82
US9842899B2Dec 12, 2017
Semiconductor wafer including a monocrystalline semiconductor layer spaced apart from a poly template layer
SEMICONDUCTOR COMPONENTS IND LLC4 citations70