Inventor
WEN YING-NAN
TW33 patents
⚠️ This page may combine multiple inventors who share the name “WEN YING-NAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
21 patentsUS10157875B2Dec 18, 2018
Chip package and method for forming the same
XINTEC INC4 citations73
US10056419B2Aug 21, 2018
Chip package having chip connected to sensing device with redistribution layer in insulator layer
XINTEC INC4 citations73
US9935148B2Apr 3, 2018
Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layer
XINTEC INC4 citations73
US9640405B2May 2, 2017
Chip package having a laser stop structure
XINTEC INC2 citations72
US9543233B2Jan 10, 2017
Chip package having a dual through hole redistribution layer structure
XINTEC INC3 citations72
US9379072B2Jun 28, 2016
Chip package and method for forming the same
XINTEC INC2 citations63
US9177919B2Nov 3, 2015
Chip package and method for forming the same
XINTEC INC3 citations63
US9406578B2Aug 2, 2016
Chip package having extended depression for electrical connection and method of manufacturing the same
XINTEC INC2 citations62
US9812413B2Nov 7, 2017
Chip module and method for forming the same
XINTEC INC0 citations52
US9153707B2Oct 6, 2015
Chip package and method for forming the same
XINTEC INC0 citations52
US9093450B2Jul 28, 2015
Chip package and manufacturing method thereof
XINTEC INC0 citations52
US8778798B1Jul 15, 2014
Electronic device package and fabrication method thereof
XINTEC INC0 citations52
US9831185B2Nov 28, 2017
Chip package and fabrication method thereof
XINTEC INC0 citations51
US9780050B2Oct 3, 2017
Method of fabricating chip package with laser
XINTEC INC0 citations51
US9768067B2Sep 19, 2017
Chip package and manufacturing method thereof
XINTEC INC0 citations51
US8766431B2Jul 1, 2014
Power MOSFET package
XINTEC INC0 citations50
US10140498B2Nov 27, 2018
Wafer-level packaging sensing device and method for forming the same
XINTEC INC0 citations42
US9281243B2Mar 8, 2016
Chip scale package structure and manufacturing method thereof
XINTEC INC0 citations42
US9236320B2Jan 12, 2016
Chip package
XINTEC INC0 citations42
US9966358B2May 8, 2018
Chip package
XINTEC INC0 citations41
US9721911B2Aug 1, 2017
Chip package and manufacturing method thereof
XINTEC INC0 citations41