Inventor
HA WOO YONG
KR3 patents
Patents
3 patentsUS9362248B2Jun 7, 2016
Coreless package structure and method for manufacturing same
ZHEN DING TECHNOLOGY CO LTD0 citations31
US9173298B2Oct 27, 2015
Packaging substrate, method for manufacturing same, and chip packaging structure having same
ZHEN DING TECHNOLOGY CO LTD0 citations31
US9165790B2Oct 20, 2015
Packaging substrate, method for manufacturing same, and chip packaging body having same
ZHEN DING TECHNOLOGY CO LTD0 citations31