Inventor
HARIRCHIAN TANNAZ
US6 patents
Patents
6 patentsUS9153552B2Oct 6, 2015
Bumpless build-up layer package including an integrated heat spreader
INTEL CORP43 citations97
US8912670B2Dec 16, 2014
Bumpless build-up layer package including an integrated heat spreader
INTEL CORP53 citations97
US9520376B2Dec 13, 2016
Bumpless build-up layer package including an integrated heat spreader
INTEL CORP11 citations83
US10424559B2Sep 24, 2019
Thermal management of molded packages
INTEL CORP5 citations70
US11769753B2Sep 26, 2023
Thermally-optimized tunable stack in cavity package-on-package
INTEL CORP0 citations57
US11469185B2Oct 11, 2022
Standoff members for semiconductor package
INTEL CORP0 citations50