Inventor
SAITO HIROSUKE
JP10 patents
⚠️ This page may combine multiple inventors who share the name “SAITO HIROSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PANASONIC IP MAN CO LTD
9 patentsUS10590223B2Mar 17, 2020
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD3 citations71
US9708468B2Jul 18, 2017
Thermosetting resin composition, prepreg, metal clad laminate plate, and printed wiring board
PANASONIC IP MAN CO LTD2 citations71
US9567481B2Feb 14, 2017
Resin composition, resin varnish, prepreg, metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD3 citations71
US12098257B2Sep 24, 2024
Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
PANASONIC IP MAN CO LTD0 citations61
US11905409B2Feb 20, 2024
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
PANASONIC IP MAN CO LTD0 citations61
US10870721B2Dec 22, 2020
Polyphenylene ether resin composition, prepreg, metal-clad laminate and printed wiring board
PANASONIC IP MAN CO LTD0 citations51
US10047213B2Aug 14, 2018
Method of curing thermosetting resin composition, thermosetting resin composition, and PREPREG, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
PANASONIC IP MAN CO LTD0 citations51
US9637598B2May 2, 2017
Method of curing thermosetting resin composition, thermosetting resin composition, and prepreg, metal-clad laminate, resin sheet, printed-wiring board, and sealing material in which thermosetting resin composition is used
PANASONIC IP MAN CO LTD0 citations51
US11477883B2Oct 18, 2022
Metal-clad laminate, metal foil with resin, and wiring board
PANASONIC IP MAN CO LTD0 citations50