Inventor
VEERARAGHAVAN SATHISH
US15 patents
⚠️ This page may combine multiple inventors who share the name “VEERARAGHAVAN SATHISH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KLA TENCOR CORP
12 patentsUS10401279B2Sep 3, 2019
Process-induced distortion prediction and feedforward and feedback correction of overlay errors
KLA TENCOR CORP10 citations84
US10025894B2Jul 17, 2018
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
KLA TENCOR CORP7 citations84
US9430593B2Aug 30, 2016
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
KLA TENCOR CORP10 citations84
US9546862B2Jan 17, 2017
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
KLA TENCOR CORP6 citations83
US9865047B1Jan 9, 2018
Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool
KLA TENCOR CORP7 citations82
US10379061B1Aug 13, 2019
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
KLA TENCOR CORP2 citations72
US10249523B2Apr 2, 2019
Overlay and semiconductor process control using a wafer geometry metric
KLA TENCOR CORP3 citations71
US11761880B2Sep 19, 2023
Process-induced distortion prediction and feedforward and feedback correction of overlay errors
KLA TENCOR CORP0 citations62
US9029810B2May 12, 2015
Using wafer geometry to improve scanner correction effectiveness for overlay control
KLA TENCOR CORP2 citations61
US10509329B2Dec 17, 2019
Breakdown analysis of geometry induced overlay and utilization of breakdown analysis for improved overlay control
KLA TENCOR CORP1 citations56
US9513565B2Dec 6, 2016
Using wafer geometry to improve scanner correction effectiveness for overlay control
KLA TENCOR CORP1 citations51
US9558545B2Jan 31, 2017
Predicting and controlling critical dimension issues and pattern defectivity in wafers using interferometry
KLA TENCOR CORP1 citations47