P

Inventor

MAIER HUBERT

AT9 patents
⚠️ This page may combine multiple inventors who share the name “MAIER HUBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

6 patents
US6605841B2Aug 12, 2003

Method for producing an electrode by means of a field effect controllable semiconductor component and field-effect-controllable semiconductor component

INFINEON TECHNOLOGIES AG16 citations80
US9219011B2Dec 22, 2015

Separation of chips on a substrate

INFINEON TECHNOLOGIES AG3 citations62
US7531439B2May 12, 2009

Method for forming an integrated semiconductor circuit arrangement

INFINEON TECHNOLOGIES AG2 citations57
US9490103B2Nov 8, 2016

Separation of chips on a substrate

INFINEON TECHNOLOGIES AG0 citations51
US9728480B2Aug 8, 2017

Passivation layer and method of making a passivation layer

INFINEON TECHNOLOGIES AG1 citations45
US9490173B2Nov 8, 2016

Method for processing wafer

INFINEON TECHNOLOGIES AG0 citations38

INFINEON TECHNOLOGIES AUSTRIA

2 patents
US7718505B2May 18, 2010

Method of forming a semiconductor structure comprising insulating layers with different thicknesses

INFINEON TECHNOLOGIES AUSTRIA2 citations58
US7834427B2Nov 16, 2010

Integrated circuit having a semiconductor arrangement

INFINEON TECHNOLOGIES AUSTRIA0 citations49

MAIER HUBERT

1 patent
US9059182B2Jun 16, 2015

Method for producing bonding connection of semiconductor device

MAIER HUBERT1 citations43