Inventor

PRATT DAVID S

US26 patents

⚠️ This page may combine multiple inventors who share the name “PRATT DAVID S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PRATT DAVID S

MICRON TECHNOLOGY INC

Surface depressions for die-to-die interconnects and associated systems and methods

Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

System including semiconductor components having through interconnects and back side redistribution conductors

Semiconductor devices with recessed interconnects

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Methods for forming conductive vias, and associated devices and systems

Semiconductor structures including sub-resolution alignment marks

Semiconductor components having through interconnects and backside redistribution conductors

Methods for forming conductive vias, and associated devices and systems

Methods for forming conductive vias, and associated devices and systems

Methods for forming conductive vias, and associated devices and systems

Stacked semiconductor devices

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Surface depressions for die-to-die interconnects and associated systems and methods

Pass-through interconnect structure for microelectronic dies and associated systems and methods

Wafer overlay marks, overlay measurement systems, and related methods

PRATT DAVID S

Biopsy device

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

Methods for fabricating sub-resolution alignment marks on semiconductor structures

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

Semiconductor devices including a through-substrate conductive member with an exposed end

Surface depressions for die-to-die interconnects and associated systems

SETCOM CORP

Mount for supporting a microphone on a helmet

Helmet attachment for a microphone