Inventor
GAGNON PASCALE
CA6 patents
⚠️ This page may combine multiple inventors who share the name “GAGNON PASCALE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
5 patentsUS10784202B2Sep 22, 2020
High-density chip-to-chip interconnection with silicon bridge
IBM33 citations89
US11791270B2Oct 17, 2023
Direct bonded heterogeneous integration silicon bridge
IBM0 citations60
US12504747B2Dec 23, 2025
Multicomponent module design and fabrication
IBM0 citations56
US11139269B2Oct 5, 2021
Mixed under bump metallurgy (UBM) interconnect bridge structure
IBM0 citations50
US9042120B2May 26, 2015
Grounded lid for micro-electronic assemblies
IBM0 citations48