Inventor · disambiguated record
Emmanuel P. Quevy
Also filed as: QUEVY EMMANUEL P · QUEVY EMMANUEL PHILIPPE
53 granted patents·2 pending applications·1,278 citations·filing 2005–2023
99Inventor score
Files withQUEVY EMMANUEL P17SILICON LAB INC12SILICON CLOCKS INC7SEMICONDUCTOR MFG INT SHANGHAI CORP5PROBIUSDX INC3
Top patents by PatentIndex Score
55 records- 0199US8349635B1Encapsulated MEMS device and method to form the sameSILICON LAB INC·Filed 2008·Granted Jan 8, 2013·256 cites·24 claims
- 0299US7923790B1Planar microshells for vacuum encapsulated devices and damascene method of manufactureSILICON LAB INC·Filed 2007·Granted Apr 12, 2011·127 cites·54 claims
- 0399US7639104B1Method for temperature compensation in MEMS resonators with isolated regions of distinct materialSILICON CLOCKS INC·Filed 2007·Granted Dec 29, 2009·91 cites·24 claims
- 0499US7211926B2Temperature compensated oscillator including MEMS resonator for frequency controlUNIV CALIFORNIA·Filed 2006·Granted May 1, 2007·133 cites·22 claims
- 0598US7659150B1Microshells for multi-level vacuum cavitiesSILICON CLOCKS INC·Filed 2007·Granted Feb 9, 2010·96 cites·18 claims
- 0698US7514760B1IC-compatible MEMS structureSILICON CLOCKS INC·Filed 2007·Granted Apr 7, 2009·88 cites·24 claims
- 0797US8313970B2Planar microshells for vacuum encapsulated devices and damascene method of manufactureQUEVY EMMANUEL P·Filed 2011·Granted Nov 20, 2012·23 cites·36 claims
- 0897US8288835B2Microshells with integrated getter layerQUEVY EMMANUEL P·Filed 2011·Granted Oct 16, 2012·31 cites·26 claims
- 0997US7595209B1Low stress thin film microshellsSILICON CLOCKS INC·Filed 2007·Granted Sep 29, 2009·58 cites·12 claims
- 1097US7256107B2Damascene process for use in fabricating semiconductor structures having micro/nano gapsUNIV CALIFORNIA·Filed 2005·Granted Aug 14, 2007·41 cites·19 claims
- 1196US7982550B1Highly accurate temperature stable clock based on differential frequency discrimination of oscillatorsSILICON LAB·Filed 2008·Granted Jul 19, 2011·31 cites·30 claims
- 1295US8273594B2Planar microshells for vacuum encapsulated devices and damascene method of manufactureQUEVY EMMANUEL P·Filed 2011·Granted Sep 25, 2012·11 cites·29 claims
- 1395US7736929B1Thin film microshells incorporating a getter layerSILICON CLOCKS INC·Filed 2007·Granted Jun 15, 2010·42 cites·14 claims
- 1495US7591201B1MEMS structure having a compensated resonating memberSILICON CLOCKS INC·Filed 2007·Granted Sep 22, 2009·36 cites·18 claims
- 1594US8878528B2MEMS-based magnetic sensor with a Lorentz force actuator used as force feedbackQUEVY EMMANUEL P·Filed 2011·Granted Nov 4, 2014·12 cites·29 claims
- 1694US7999635B1Out-of plane MEMS resonator with static out-of-plane deflectionSILICON LAB INC·Filed 2008·Granted Aug 16, 2011·29 cites·34 claims
- 1793US7514853B1MEMS structure having a stress inverter temperature-compensated resonating memberSILICON CLOCKS INC·Filed 2007·Granted Apr 7, 2009·29 cites·45 claims
- 1892US9000833B2Compensation of changes in MEMS capacitive transductionSILICON LAB INC·Filed 2013·Granted Apr 7, 2015·7 cites·18 claims
- 1991US8258893B2Out-of-plane MEMS resonator with static out-of-plane deflectionQUEVY EMMANUEL P·Filed 2011·Granted Sep 4, 2012·11 cites·20 claims
- 2091US7876167B1Hybrid system having a non-MEMS device and a MEMS deviceSILICON LAB INC·Filed 2008·Granted Jan 25, 2011·20 cites·48 claims
- 2191US7858422B1MEMS coupler and method to form the sameSILICON LABS SC INC·Filed 2007·Granted Dec 28, 2010·16 cites·37 claims
- 2290US8436690B2Hybrid system having a non-MEMS device and a MEMS deviceMCCRAITH ANDREW D·Filed 2010·Granted May 7, 2013·12 cites·70 claims
- 2389US8461935B2Hybrid system having a non-MEMS device and a MEMS deviceMCCRAITH ANDREW D·Filed 2010·Granted Jun 11, 2013·11 cites·73 claims
- 2489US7956517B1MEMS structure having a stress inverter temperature-compensated resonator memberSILICON LAB·Filed 2008·Granted Jun 7, 2011·17 cites·24 claims
- 2585US8058940B1Dual in-situ mixing for extended tuning range of resonatorsQUEVY EMMANUEL P·Filed 2009·Granted Nov 15, 2011·11 cites·24 claims
- 2684US8852984B1Technique for forming a MEMS deviceQUEVY EMMANUEL P·Filed 2011·Granted Oct 7, 2014·10 cites·24 claims
- 2778US9300227B2Monolithic body MEMS devicesSILICON LAB INC·Filed 2013·Granted Mar 29, 2016·2 cites·28 claims
- 2877US11054380B2All-electronic high-throughput analyte detection systemPROBIUSDX INC·Filed 2018·Granted Jul 6, 2021·1 cites·15 claims
- 2977US9422149B2Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2014·Granted Aug 23, 2016·1 cites·11 claims
- 3077US8877536B1Technique for forming a MEMS device using island structuresQUEVY EMMANUEL P·Filed 2011·Granted Nov 4, 2014·4 cites·22 claims
- 3176US9007119B2Integrated MEMS design for manufacturingSILICON LAB INC·Filed 2013·Granted Apr 14, 2015·2 cites·21 claims
- 3273US8669831B2Method for temperature compensation in MEMS resonators with isolated regions of distinct materialQUEVY EMMANUEL P·Filed 2010·Granted Mar 11, 2014·1 cites·28 claims
- 3373US7816166B1Method to form a MEMS structure having a suspended portionSILICON LABS SC INC·Filed 2007·Granted Oct 19, 2010·4 cites·21 claims
- 3472US9428377B2Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)SILICON LAB INC·Filed 2014·Granted Aug 30, 2016·1 cites·9 claims
- 3570US11921077B2All-electronic high-throughput analyte detection systemPROBIUSDX INC·Filed 2021·Granted Mar 5, 2024·0 cites·8 claims
- 3669US9246412B2Suspended passive element for MEMS devicesSILICON LAB INC·Filed 2013·Granted Jan 26, 2016·1 cites·21 claims
- 3769US9018715B2Gas-diffusion barriers for MEMS encapsulationSILICON LAB INC·Filed 2012·Granted Apr 28, 2015·2 cites·20 claims
- 3866US9422157B2Method for temperature compensation in MEMS resonators with isolated regions of distinct materialSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2013·Granted Aug 23, 2016·1 cites·21 claims
- 3966US8686806B2Highly accurate temperature stable clock based on differential frequency discrimination of oscillatorsQUEVY EMMANUEL P·Filed 2011·Granted Apr 1, 2014·2 cites·19 claims
- 4065US2024226884A9Modular analyte sensing systemPROBIUSDX INC·Filed 2023·Application pending·0 cites
- 4163US10173893B2Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)SEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2016·Granted Jan 8, 2019·0 cites·16 claims
- 4263US8329559B2Damascene process for use in fabricating semiconductor structures having micro/nano gapsTAKEUCHI HIDEKI·Filed 2007·Granted Dec 11, 2012·1 cites·27 claims
- 4362US10118820B2Membrane transducer structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Nov 6, 2018·0 cites·10 claims
- 4462US9637371B2Membrane transducer structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2014·Granted May 2, 2017·0 cites·10 claims
- 4562US9602026B2Temperature compensation for MEMS devicesSILICON LAB INC·Filed 2013·Granted Mar 21, 2017·1 cites·10 claims
- 4661US8629739B2Out-of plane MEMS resonator with static out-of-plane deflectionQUEVY EMMANUEL P·Filed 2012·Granted Jan 14, 2014·1 cites·20 claims
- 4760US8427251B2Temperature compensated oscillator including MEMS resonator for frequency controlQUEVY EMMANUEL P·Filed 2007·Granted Apr 23, 2013·3 cites·17 claims
- 4855US9988265B2Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INTERNATIONAL CORPORATION·Filed 2016·Granted Jun 5, 2018·0 cites·10 claims
- 4953US9260290B2Technique for forming a MEMS deviceSILICON LAB INC·Filed 2014·Granted Feb 16, 2016·0 cites·19 claims
- 5052US8716815B2MEMS coupler and method to form the sameQUEVY EMMANUEL P·Filed 2010·Granted May 6, 2014·0 cites·34 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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