Inventor · disambiguated record
Jeremy R. Hui
Also filed as: HUI JEREMY · HUI JEREMY R · HUI JEREMY RYAN
11 granted patents·1 pending application·13 citations·filing 2011–2023
84Inventor score
Files withSEMICONDUCTOR MFG INT SHANGHAI CORP4PROBIUSDX INC3SILICON LAB INC2KNOWLES ELECTRONICS LLC1QUEVY EMMANUEL P1
Top patents by PatentIndex Score
12 records- 0184US8852984B1Technique for forming a MEMS deviceQUEVY EMMANUEL P·Filed 2011·Granted Oct 7, 2014·10 cites·24 claims
- 0277US11054380B2All-electronic high-throughput analyte detection systemPROBIUSDX INC·Filed 2018·Granted Jul 6, 2021·1 cites·15 claims
- 0377US9422149B2Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2014·Granted Aug 23, 2016·1 cites·11 claims
- 0472US9428377B2Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)SILICON LAB INC·Filed 2014·Granted Aug 30, 2016·1 cites·9 claims
- 0570US11921077B2All-electronic high-throughput analyte detection systemPROBIUSDX INC·Filed 2021·Granted Mar 5, 2024·0 cites·8 claims
- 0665US2024226884A9Modular analyte sensing systemPROBIUSDX INC·Filed 2023·Application pending·0 cites
- 0763US10173893B2Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)SEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2016·Granted Jan 8, 2019·0 cites·16 claims
- 0862US10118820B2Membrane transducer structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2017·Granted Nov 6, 2018·0 cites·10 claims
- 0962US9637371B2Membrane transducer structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INT SHANGHAI CORP·Filed 2014·Granted May 2, 2017·0 cites·10 claims
- 1055US9988265B2Trapped sacrificial structures and methods of manufacturing same using thin-film encapsulationSEMICONDUCTOR MFG INTERNATIONAL CORPORATION·Filed 2016·Granted Jun 5, 2018·0 cites·10 claims
- 1153US9260290B2Technique for forming a MEMS deviceSILICON LAB INC·Filed 2014·Granted Feb 16, 2016·0 cites·19 claims
- 1237US11274034B2Acoustic relief in MEMSKNOWLES ELECTRONICS LLC·Filed 2018·Granted Mar 15, 2022·0 cites·7 claims
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