Inventor

CHOO JAE OUK

US11 patents

⚠️ This page may combine multiple inventors who share the name “CHOO JAE OUK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

AIR PROD & CHEM

6 patents

US9305806B2Apr 5, 2016

Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

AIR PROD & CHEM9 citations81

US8974692B2Mar 10, 2015

Chemical mechanical polishing slurry compositions and method using the same for copper and through-silicon via applications

AIR PROD & CHEM5 citations81

US9062230B2Jun 23, 2015

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

AIR PROD & CHEM2 citations59

US10011741B2Jul 3, 2018

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

AIR PROD & CHEM0 citations49

US9305476B2Apr 5, 2016

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

AIR PROD & CHEM0 citations49

US8859428B2Oct 14, 2014

Chemical mechanical polishing (CMP) composition for shallow trench isolation (STI) applications and methods of making thereof

AIR PROD & CHEM0 citations48

SAMSUNG ELECTRONICS CO LTD

5 patents

US7452817B2Nov 18, 2008

CMP method providing reduced thickness variations

SAMSUNG ELECTRONICS CO LTD18 citations80

US7642148B2Jan 5, 2010

Methods of producing semiconductor devices including multiple stress films in interface area

SAMSUNG ELECTRONICS CO LTD7 citations73

US7785951B2Aug 31, 2010

Methods of forming integrated circuit devices having tensile and compressive stress layers therein and devices formed thereby

SAMSUNG ELECTRONICS CO LTD3 citations62

US7902609B2Mar 8, 2011

Semiconductor devices including multiple stress films in interface area

SAMSUNG ELECTRONICS CO LTD0 citations51

US7595253B2Sep 29, 2009

Method of forming the semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations37