Inventor
JENG SHWANG-MING
TW42 patents
⚠️ This page may combine multiple inventors who share the name “JENG SHWANG-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
24 patentsUS6372661B1Apr 16, 2002
Method to improve the crack resistance of CVD low-k dielectric constant material
TAIWAN SEMICONDUCTOR MFG60 citations96
US6846756B2Jan 25, 2005
Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers
TAIWAN SEMICONDUCTOR MFG39 citations93
US6657284B1Dec 2, 2003
Graded dielectric layer and method for fabrication thereof
TAIWAN SEMICONDUCTOR MFG24 citations93
US7564136B2Jul 21, 2009
Integration scheme for Cu/low-k interconnects
TAIWAN SEMICONDUCTOR MFG31 citations92
US7482265B2Jan 27, 2009
UV curing of low-k porous dielectrics
TAIWAN SEMICONDUCTOR MFG22 citations92
US6821905B2Nov 23, 2004
Method for avoiding carbon and nitrogen contamination of a dielectric insulating layer
TAIWAN SEMICONDUCTOR MFG24 citations91
US6753260B1Jun 22, 2004
Composite etching stop in semiconductor process integration
TAIWAN SEMICONDUCTOR MFG29 citations91
US7723226B2May 25, 2010
Interconnects containing bilayer porous low-k dielectrics using different porogen to structure former ratio
TAIWAN SEMICONDUCTOR MFG11 citations84
US7365026B2Apr 29, 2008
CxHy sacrificial layer for cu/low-k interconnects
TAIWAN SEMICONDUCTOR MFG10 citations83
US7805692B2Sep 28, 2010
Method for local hot spot fixing
TAIWAN SEMICONDUCTOR MFG7 citations74
US7626245B2Dec 1, 2009
Extreme low-k dielectric film scheme for advanced interconnect
TAIWAN SEMICONDUCTOR MFG7 citations73
US7646097B2Jan 12, 2010
Bond pads and methods for fabricating the same
TAIWAN SEMICONDUCTOR MFG6 citations70
US7485949B2Feb 3, 2009
Semiconductor device
TAIWAN SEMICONDUCTOR MFG4 citations63
US7314828B2Jan 1, 2008
Repairing method for low-k dielectric materials
TAIWAN SEMICONDUCTOR MFG6 citations63
USRE42514EJul 5, 2011
Extreme low-K dielectric film scheme for advanced interconnects
TAIWAN SEMICONDUCTOR MFG2 citations62
US7465676B2Dec 16, 2008
Method for forming dielectric film to improve adhesion of low-k film
TAIWAN SEMICONDUCTOR MFG3 citations62
US7042049B2May 9, 2006
Composite etching stop in semiconductor process integration
TAIWAN SEMICONDUCTOR MFG2 citations61
US6869836B1Mar 22, 2005
ILD stack with improved CMP results
TAIWAN SEMICONDUCTOR MFG2 citations60
US6620745B2Sep 16, 2003
Method for forming a blocking layer
TAIWAN SEMICONDUCTOR MFG4 citations59
US9004914B2Apr 14, 2015
Method of and apparatus for active energy assist baking
TAIWAN SEMICONDUCTOR MFG0 citations52
US8877083B2Nov 4, 2014
Surface treatment in the formation of interconnect structure
TAIWAN SEMICONDUCTOR MFG0 citations52
USRE41935ENov 16, 2010
Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers
TAIWAN SEMICONDUCTOR MFG0 citations52
US7405481B2Jul 29, 2008
Glue layer for adhesion improvement between conductive line and etch stop layer in an integrated circuit chip
TAIWAN SEMICONDUCTOR MFG0 citations52
US9368452B2Jun 14, 2016
Metal conductor chemical mechanical polish
TAIWAN SEMICONDUCTOR MFG0 citations51
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS10510580B2Dec 17, 2019
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11664268B2May 30, 2023
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11069558B2Jul 20, 2021
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12154822B2Nov 26, 2024
Dummy fin structures and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9589856B2Mar 7, 2017
Automatically adjusting baking process for low-k dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10144109B2Dec 4, 2018
Polisher, polishing tool, and polishing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51