Inventor

GOESELE ULRICH

DE8 patents

⚠️ This page may combine multiple inventors who share the name “GOESELE ULRICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MAX PLANCK GESELLSCHAFT

3 patents

US6589333B1Jul 8, 2003

Method for the manufacture of a substrate, substrate manufactured in accordance with this method, carrier wafer and diamond jewel

MAX PLANCK GESELLSCHAFT24 citations92

US6010591AJan 4, 2000

Method for the releasable bonding and subsequent separation of reversibly bonded and polished wafers and also a wafer structure and wafer

MAX PLANCK GESELLSCHAFT48 citations91

US5985412ANov 16, 1999

Method of manufacturing microstructures and also microstructure

MAX PLANCK GESELLSCHAFT43 citations91

SIEMENS AG

2 patents

US4672738AJun 16, 1987

Method for the manufacture of a pn junction with high breakdown voltage

SIEMENS AG48 citations92

US4907056AMar 6, 1990

Semiconductor component comprising a planar pn-junction

SIEMENS AG8 citations73

(unassigned)

1 patent

US5915193AJun 22, 1999

Method for the cleaning and direct bonding of solids

82 citations95

MAX PLANCK INST FUR MIKROSTRUK

1 patent

US6663989B2Dec 16, 2003

Non c-axis oriented bismuth-layered perovskite ferroelectric structure epitaxially grown on buffered silicon

MAX PLANCK INST FUR MIKROSTRUK15 citations74

MAX PLANCK INST FUER MIKROSTRU

1 patent

US6531235B2Mar 11, 2003

Non-c-axis oriented bismuth-layered perovskite ferroelectric structure epitaxially grown on buffered silicon

MAX PLANCK INST FUER MIKROSTRU10 citations63