Inventor
HISADA JUN
JP3 patents
Patents
3 patentsUS6733886B2May 11, 2004
Laminate and method of manufacturing the same
MEC CO LTD9 citations69
US7029761B2Apr 18, 2006
Bonding layer for bonding resin on copper surface
MEC CO LTD5 citations59
US7156904B2Jan 2, 2007
Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby
MEC CO LTD3 citations56