Inventor
HAJJI ASMA
FR5 patents
Patents
5 patentsUS12170262B2Dec 17, 2024
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
ST MICROELECTRONICS GRENOBLE 20 citations59
US11557566B2Jan 17, 2023
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
ST MICROELECTRONICS GRENOBLE 20 citations59
US12278155B2Apr 15, 2025
Integrated circuit package with heat sink and manufacturing method thereof
ST MICROELECTRONICS GRENOBLE 21 citations54
US10643970B2May 5, 2020
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
ST MICROELECTRONICS GRENOBLE 20 citations49
US10224306B2Mar 5, 2019
Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
ST MICROELECTRONICS GRENOBLE 20 citations49