Inventor
WANG KUO K
US6 patents
Patents
6 patentsUS5817545AOct 6, 1998
Pressurized underfill encapsulation of integrated circuits
CORNELL RES FOUNDATION INC123 citations96
US5501266AMar 26, 1996
Method and apparatus for injection molding of semi-solid metals
CORNELL RES FOUNDATION INC104 citations94
US6000924ADec 14, 1999
Pressurized underfill encapsulation of integrated circuits
CORNELL RES FOUNDATION INC89 citations93
US6023962AFeb 15, 2000
Reservoir-slit rheometer for the viscosity measurement of fast-reacting polymers
CORNELL RES FOUNDATION INC35 citations90
US4861167AAug 29, 1989
Line-heat-source thermal conductivity measuring system
CORNELL RES FOUNDATION INC29 citations89
US5572434ANov 5, 1996
Method for simulating mold filling of semi-solid material
CORNELL RES FOUNDATION INC31 citations88