Inventor
HAN SEJIN
US5 patents
⚠️ This page may combine multiple inventors who share the name “HAN SEJIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CORNELL RES FOUNDATION INC
3 patentsUS5817545AOct 6, 1998
Pressurized underfill encapsulation of integrated circuits
CORNELL RES FOUNDATION INC123 citations96
US6000924ADec 14, 1999
Pressurized underfill encapsulation of integrated circuits
CORNELL RES FOUNDATION INC89 citations93
US6023962AFeb 15, 2000
Reservoir-slit rheometer for the viscosity measurement of fast-reacting polymers
CORNELL RES FOUNDATION INC35 citations90
LG CHEMICAL LTD
2 patentsUS12240971B2Mar 4, 2025
Thermoplastic resin composition, method of preparing the same, and molded article including the same
LG CHEMICAL LTD0 citations58
US11702536B2Jul 18, 2023
Thermoplastic resin composition, method of preparing thermoplastic resin composition, and metal-plated molded article manufactured using thermoplastic resin composition
LG CHEMICAL LTD0 citations49