Inventor

LAI SAY-TENG

SG2 patents

Patents

2 patents

US6236015B1May 22, 2001

Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding

HEWLETT PACKARD CO11 citations69

US6476346B2Nov 5, 2002

Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding

HEWLETT PACKARD CO1 citations48