Inventor

LI FU-JEN

TW24 patents

⚠️ This page may combine multiple inventors who share the name “LI FU-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LI FU-JEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device package with warpage control structure

Semiconductor device package with warpage control structure

Package-on-package structure with through molding via

3D packages and methods for forming the same

Packages with multi-thermal interface materials and methods of fabricating the same

Semiconductor device package having warpage control

Method for forming chip package structure

Semiconductor device package having warpage control and method of forming the same

Method for forming chip package structure

Semiconductor device package with warpage control structure

Semiconductor device package with warpage control structure

Methods for selectively forming identification mark on semiconductor wafer

Semiconductor packages

Semiconductor packages and method of manufacturing the same

Package-on-package structure with through molding via

Electrical connection for chip scale packaging

Package-on-package structure with through molding via

Mini identification mark in die-less region of semiconductor wafer

TAIWAN SEMICONDUCTOR MFG

Package-on-package structure with through molding via

Semiconductor device package and method

3D packages and methods for forming the same

Electrical connection for chip scale packaging

YEW MING-CHIH

Electrical connection for chip scale packaging

Electrical connection for chip scale packaging