Inventor
KIM SUNG-KYU
KR100 patents
⚠️ This page may combine multiple inventors who share the name “KIM SUNG-KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYUNDAI MOTOR CO LTD
11 patentsUS9738160B2Aug 22, 2017
Fail-safe method and apparatus for high voltage parts in a hybrid vehicle
HYUNDAI MOTOR CO LTD38 citations93
US9007013B2Apr 14, 2015
Inverter control method and system for eco-friendly vehicle
HYUNDAI MOTOR CO LTD10 citations84
US10857898B2Dec 8, 2020
Charging system and method for vehicle
HYUNDAI MOTOR CO LTD4 citations73
US10483900B2Nov 19, 2019
System and method for controlling inverter for driving motor
HYUNDAI MOTOR CO LTD2 citations73
US9172316B2Oct 27, 2015
Inverter control method and system for eco-friendly vehicle
HYUNDAI MOTOR CO LTD5 citations73
US10476419B2Nov 12, 2019
Method of controlling dual inverter
HYUNDAI MOTOR CO LTD5 citations72
US10293807B2May 21, 2019
Power control system and method for hybrid vehicle
HYUNDAI MOTOR CO LTD2 citations72
US10256754B2Apr 9, 2019
Apparatus and method for compensating for position error of resolver
HYUNDAI MOTOR CO LTD2 citations72
US9481354B2Nov 1, 2016
Emergency operation method of hybrid vehicle
HYUNDAI MOTOR CO LTD3 citations72
US8994304B2Mar 31, 2015
Method for controlling interior permanent magnet synchronous motor
HYUNDAI MOTOR CO LTD6 citations72
US10243388B2Mar 26, 2019
Charging system using wound rotor synchronous motor
HYUNDAI MOTOR CO LTD1 citations61
AMKOR TECHNOLOGY INC
8 patentsUS9831282B2Nov 28, 2017
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC9 citations92
US9129873B2Sep 8, 2015
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC10 citations92
US8946883B2Feb 3, 2015
Wafer level fan-out package with a fiducial die
AMKOR TECHNOLOGY INC23 citations92
US10692918B2Jun 23, 2020
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC3 citations84
US10304890B2May 28, 2019
Electronic device package and fabricating method thereof
AMKOR TECHNOLOGY INC5 citations84
US9431447B2Aug 30, 2016
Package of finger print sensor and fabricating method thereof
AMKOR TECHNOLOGY INC8 citations84
US9406639B2Aug 2, 2016
Semiconductor package and manufacturing method thereof
AMKOR TECHNOLOGY INC2 citations63
US10903181B2Jan 26, 2021
Wafer level fan out semiconductor device and manufacturing method thereof
AMKOR TECHNOLOGY INC0 citations62
KOREA INST SCI & TECH
6 patentsUS8032842B2Oct 4, 2011
System and method for three-dimensional interaction based on gaze and system and method for tracking three-dimensional gaze
KOREA INST SCI & TECH24 citations88
US10178377B2Jan 8, 2019
3-dimensional image display device and method for designing 3-dimensional image display device
KOREA INST SCI & TECH3 citations73
US9674509B2Jun 6, 2017
Multi-view 3D image display apparatus using modified common viewing zone
KOREA INST SCI & TECH3 citations73
US9654766B2May 16, 2017
3-dimensional displaying apparatus using line light source
KOREA INST SCI & TECH2 citations73
US10194143B2Jan 29, 2019
Autostereoscopic 3D image display apparatus having modified sub-pixel structure
KOREA INST SCI & TECH1 citations63
US7898568B2Mar 1, 2011
Image display system
KOREA INST SCI & TECH3 citations63
KIM SUNG KYU
5 patentsUS9832457B2Nov 28, 2017
Autostereoscopic 3D image display device for flattening viewing zone and minimizing dynamic crosstalk
KIM SUNG KYU2 citations73
US8941918B2Jan 27, 2015
3D image display device
KIM SUNG KYU4 citations71
US8912736B2Dec 16, 2014
DC-DC converter system of an electric vehicle and control method thereof
KIM SUNG KYU4 citations70
US10237543B2Mar 19, 2019
Device for displaying multi-view 3D image using dynamic viewing zone expansion applicable to multiple observers and method for same
KIM SUNG KYU1 citations62
US9188788B2Nov 17, 2015
3-dimensional displaying apparatus and method for driving 3-dimensional displaying apparatus
KIM SUNG KYU3 citations62
SK HYNIX INC
5 patentsUS11823982B2Nov 21, 2023
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC2 citations71
US11594471B2Feb 28, 2023
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC2 citations71
US12040308B2Jul 16, 2024
Method of manufacturing a semiconductor device
SK HYNIX INC0 citations63
US12463114B2Nov 4, 2025
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations61
US12327779B2Jun 10, 2025
Semiconductor chip including through electrode, and semiconductor package including the same
SK HYNIX INC0 citations61
AMKOR TECH SINGAPORE HOLDING PTE LTD
4 patentsUS12230661B2Feb 18, 2025
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11961867B2Apr 16, 2024
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11855023B2Dec 26, 2023
Wafer level fan out semiconductor device and manufacturing method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
US11362128B2Jun 14, 2022
Electronic device package and fabricating method thereof
AMKOR TECH SINGAPORE HOLDING PTE LTD0 citations62
KIM SANG WON
1 patentLEE YOUNG KOOK
1 patentISOLTECH CO LTD
1 patentSAMSUNG ELECTRONICS CO LTD
1 patentPOSCO
1 patentSOHN IL-RYOUNG
1 patentKIM CHUL WOO
1 patentJEON WOO YONG
1 patentKIM SEONG-JU
1 patentST MICROELECTRONICS ASIA PACIFIC PTE LTD
1 patentKERI KOREA ELECTROTECHNOLOGY RES INST
1 patentShowing the top 50 of 100 patents by PatentIndex Score.