Inventor
KERSTEN DALE
US13 patents
Patents
13 patentsUS9781844B2Oct 3, 2017
Simultaneous and selective wide gap partitioning of via structures using plating resist
SANMINA CORP5 citations82
US9781830B2Oct 3, 2017
Simultaneous and selective wide gap partitioning of via structures using plating resist
SANMINA CORP11 citations82
US11399439B2Jul 26, 2022
Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
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US10188001B2Jan 22, 2019
Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board
SANMINA CORP3 citations70
US12150254B2Nov 19, 2024
Method of forming a laminate structure having a plated through-hole using a removable cover layer
SANMINA CORP0 citations61
US11765827B2Sep 19, 2023
Simultaneous and selective wide gap partitioning of via structures using plating resist
SANMINA CORP0 citations61
US11246226B2Feb 8, 2022
Laminate structures with hole plugs and methods of forming laminate structures with hole plugs
SANMINA CORP0 citations61
US12575036B2Mar 10, 2026
Method of forming high aspect ratio plated through holes
SANMINA CORP0 citations60
US10757819B2Aug 25, 2020
Method of forming a laminate structure having a plated through-hole using a removable cover layer
SANMINA CORP0 citations51
US10362687B2Jul 23, 2019
Simultaneous and selective wide gap partitioning of via structures using plating resist
SANMINA CORP0 citations51
US10237983B2Mar 19, 2019
Method for forming hole plug
SANMINA CORP0 citations51
US10123432B2Nov 6, 2018
Simultaneous and selective wide gap partitioning of via structures using plating resist
SANMINA CORP0 citations51
US10667390B2May 26, 2020
Simultaneous and selective wide gap partitioning of via structures using plating resist
SANMINA CORP0 citations50