Inventor

LIN HSIU-JEN

TW145 patents

⚠️ This page may combine multiple inventors who share the name “LIN HSIU-JEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN HSIU-JEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Methods of forming connector pad structures, interconnect structures, and structures thereof

Dicing in wafer level package

Integrated fan-out packages with embedded heat dissipation structure

Package structure

Semiconductor structure and method of fabricating the same

Electronic device and manufacturing method thereof

Semiconductor packages having dummy connectors and methods of forming same

Semiconductor packages having dummy connectors and methods of forming same

Structure and formation method of chip package with fan-out structure

Integrated fan-out package and method of fabricating the same

Package structure and method of fabricating the same

Integrated fan-out structure and method

Substrate and package structure

Package structure and method of fabrcating the same

Semiconductor structure and method of fabricating the same

Package structure

Semiconductor package and method

Package structure with porous conductive structure and manufacturing method thereof

Warpage control in the packaging of integrated circuits

Semiconductor package and method of forming the same

Integrated circuit package and method

Method for manufacturing interconnect structure

Semiconductor package and method

Package structure

Integrated fan-out packages with embedded heat dissipation structure

Stud bump structure for semiconductor package assemblies

Semiconductor packages having dummy connectors and methods of forming same

Methods of forming connector pad structures, interconnect structures, and structures thereof

Semiconductor package and method

Package structure and method of forming package structure

Manufacturing method of package on package structure

Methods of forming connector pad structures, interconnect structures, and structures thereof

Warpage control in the packaging of integrated circuits

Semiconductor processing boat design with pressure sensor

Package-on-package structures and methods for forming the same

Methods of forming connector pad structures, interconnect structures, and structures thereof

Substrate and package structure

Package structure and method for manufacturing the same

Methods of forming connector pad structures, interconnect structures, and structures thereof

Dicing in wafer level package

TAIWAN SEMICONDUCTOR MFG

Packaging methods and packaged semiconductor devices

Package on package structure and method of manufacturing the same

Package on package structure and method of manufacturing the same

LU WEN-HSIUNG

Forming wafer-level chip scale package structures with reduced number of seed layers

Package on package interconnect structure

LIN HSIU-JEN

Methods for performing reflow in bonding processes

Die-bonding method of LED chip and LED manufactured by the same

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

LIM ZHENG-YI

Method of forming metal pillar

LIN CHENG-CHUNG

System and method for fine pitch PoP structure