P

Inventor

LIN DIANN-FANG

TW15 patents
⚠️ This page may combine multiple inventors who share the name “LIN DIANN-FANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAWNING LEADING TECH INC

5 patents
US9892988B2Feb 13, 2018

Semiconductor packaging structure and manufacturing method for the same

DAWNING LEADING TECH INC2 citations70
US9412722B1Aug 9, 2016

Multichip stacking package structure and method for manufacturing the same

DAWNING LEADING TECH INC4 citations70
US9646937B2May 9, 2017

Packaging structure for thin die and method for manufacturing the same

DAWNING LEADING TECH INC0 citations49
US9887145B2Feb 6, 2018

Metal top stacking package structure and method for manufacturing the same

DAWNING LEADING TECH INC0 citations39
US9607933B2Mar 28, 2017

Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure

DAWNING LEADING TECH INC0 citations39

LIN DIANN-FANG

3 patents
US8058102B2Nov 15, 2011

Package structure and manufacturing method thereof

LIN DIANN-FANG5 citations71
US8749048B2Jun 10, 2014

Package structure

LIN DIANN-FANG0 citations49
US8962390B2Feb 24, 2015

Method for manufacturing a chip packaging structure

LIN DIANN-FANG0 citations38

ADVANCED CHIP ENG TECH INC

2 patents
US7525185B2Apr 28, 2009

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

ADVANCED CHIP ENG TECH INC14 citations83
US7763494B2Jul 27, 2010

Semiconductor device package with multi-chips and method of the same

ADVANCED CHIP ENG TECH INC5 citations62

LIN DIANN FANG

1 patent
US10651146B2May 12, 2020

Chip packaging structure and manufacturing method for the same

LIN DIANN FANG1 citations59

ADAVANCED CHIP ENGINEERING TEC

1 patent
US7498556B2Mar 3, 2009

Image sensor module having build-in package cavity and the method of the same

ADAVANCED CHIP ENGINEERING TEC6 citations56

KING YUAN ELECTRONICS CO LTD

1 patent
US7369957B2May 6, 2008

Method and system for generating test pulses to test electronic elements

KING YUAN ELECTRONICS CO LTD2 citations53

ASMEDITRON INC

1 patent
US11927430B2Mar 12, 2024

Dartboard structure and method for manufacturing the same

ASMEDITRON INC1 citations50

DAWNING LEADING TECHNOLOGY INC

1 patent
US9161446B2Oct 13, 2015

Micro electronic component structure

DAWNING LEADING TECHNOLOGY INC0 citations33