Inventor
VILLAVICENCIO GRANT
US11 patents
⚠️ This page may combine multiple inventors who share the name “VILLAVICENCIO GRANT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INVENSAS CORP
4 patentsUS9508689B2Nov 29, 2016
Electrical connector between die pad and z-interconnect for stacked die assemblies
INVENSAS CORP2 citations58
US10806036B2Oct 13, 2020
Pressing of wire bond wire tips to provide bent-over tips
INVENSAS CORP0 citations51
US9888579B2Feb 6, 2018
Pressing of wire bond wire tips to provide bent-over tips
INVENSAS CORP0 citations51
US9659848B1May 23, 2017
Stiffened wires for offset BVA
INVENSAS CORP0 citations41
CO REYNALDO
3 patentsUS8680687B2Mar 25, 2014
Electrical interconnect for die stacked in zig-zag configuration
CO REYNALDO7 citations81
US9153517B2Oct 6, 2015
Electrical connector between die pad and z-interconnect for stacked die assemblies
CO REYNALDO5 citations79
US8884403B2Nov 11, 2014
Semiconductor die array structure
CO REYNALDO2 citations60