Inventor

LIU HENG-KAI

TW9 patents

⚠️ This page may combine multiple inventors who share the name “LIU HENG-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

5 patents

US9342646B2May 17, 2016

Method, system and computer readable medium using stitching for mask assignment of patterns

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62

US8966426B1Feb 24, 2015

Partitioning method and system for 3D IC

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations62

US9824968B2Nov 21, 2017

Method, system and computer readable medium using stitching for mask assignment of patterns

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

US9685395B2Jun 20, 2017

Wiring layout having differently shaped vias

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

US9514261B2Dec 6, 2016

Partitioning method and system for 3D IC

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51

TAIWAN SEMICONDUCTOR MFG

1 patent

US7404167B2Jul 22, 2008

Method for improving design window

TAIWAN SEMICONDUCTOR MFG12 citations83

HUANG MU-JEN

1 patent

US8806414B2Aug 12, 2014

Method and system for layout parasitic estimation

HUANG MU-JEN14 citations82

TSENG HSIEN-YU

1 patent

US8745552B2Jun 3, 2014

EDA tool and method, and integrated circuit formed by the method

TSENG HSIEN-YU4 citations67

CHUANG HARRY

1 patent

US8981562B2Mar 17, 2015

Wiring layout having differently shaped vias

CHUANG HARRY1 citations61