Inventor
CHOI HEE-KOOK
KR12 patents
Patents
12 patentsUS7098407B2Aug 29, 2006
Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate
SAMSUNG ELECTRONICS CO LTD100 citations98
US7170158B2Jan 30, 2007
Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
SAMSUNG ELECTRONICS CO LTD73 citations97
US5979739ANov 9, 1999
Semiconductor die bonding apparatus having multiple bonding system
SAMSUNG ELECTRONICS CO LTD59 citations94
US5765277AJun 16, 1998
Die bonding apparatus with a revolving pick-up tool
SAMSUNG ELECTRONICS CO LTD65 citations94
US6386432B1May 14, 2002
Semiconductor die pickup method that prevents electrostatic discharge
SAMSUNG ELECTRONICS CO LTD19 citations92
US6321971B1Nov 27, 2001
Die collet for a semiconductor chip and apparatus for bonding semiconductor chip to a lead frame
SAMSUNG ELECTRONICS CO LTD23 citations92
US6348363B1Feb 19, 2002
Method for manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD32 citations88
US7030489B2Apr 18, 2006
Multi-chip module having bonding wires and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations73
US5886405AMar 23, 1999
Semiconductor device package having inner leads with slots
SAMSUNG ELECTRONICS CO LTD15 citations73
US5811132ASep 22, 1998
Mold for semiconductor packages
SAMSUNG ELECTRONICS CO LTD10 citations71
US7825495B2Nov 2, 2010
Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7485006B2Feb 3, 2009
Memory module, socket and mounting method providing improved heat dissipating characteristics
SAMSUNG ELECTRONICS CO LTD2 citations61