Inventor

TSUNODA SHIGEHARU

JP32 patents

⚠️ This page may combine multiple inventors who share the name “TSUNODA SHIGEHARU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSUNODA SHIGEHARU

HITACHI LTD

Semiconductor device having a ball grid array package structure using a supporting frame

Semiconductor device structure

Method of uniformly encapsulating a semiconductor device in resin

Resin encapsulating apparatus for semiconductor devices

Method of producing semiconductor devices

Semiconductor device and method for producing the same

Semiconductor device and method for manufacturing the same

Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame

Electronic device, rubber product, and methods for manufacturing the same

Wireless communication medium and method of manufacturing the same

Method of encapsulating semiconductor chips

Method of manufacturing RFID

Layer laminating molded object, powder layer laminating molding method, and ridge filter

Resin powder material, laser powder molding method and device

Powder layered modeling apparatus

HITACHI AUTOMOTIVE SYSTEMS LTD

Flow sensor with a protruding portion for height control and a cover for suppressing sinking of the cover during welding

Electronic control device and method for manufacturing electronic control device

Flow sensor

Flow sensor

Laser welded structure, electronic controller and manufacture method for laser welded structure

Flow sensor and manufacturing method thereof

Flow sensor and method for producing resin structure

RENESAS TECH CORP

Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure

Semiconductor apparatus including insulating layer having a protrusive portion

Method for producing a semiconductor device

Semiconductor device having projected electrodes and structure for mounting the same

Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame

Semiconductor devices and methods of making the devices

ARAI SATOSHI

Flow sensor with a housing that accommodates an auxiliary channel having an opening into which a fluid to be measured is taken

NISHINO HIDEHIKO

Ingot cutting apparatus and ingot cutting method

YAMAGUCHI MASAHIRO

Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate

OOZEKI YOSHIO

Pipe module