Inventor
SONG AI JUN
US3 patents
Patents
3 patentsUS11011493B2May 18, 2021
Bonding and placement tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KULICKE & SOFFA IND INC0 citations55
US11342301B2May 24, 2022
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KULICKE & SOFFA IND INC0 citations51
US11049839B2Jun 29, 2021
Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods
KULICKE & SOFFA IND INC0 citations51