Inventor

TAI DYSON H

US64 patents

⚠️ This page may combine multiple inventors who share the name “TAI DYSON H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAI DYSON H

OMNIVISION TECH INC

Stacked-chip backside-illuminated SPAD sensor with high fill-factor

CMOS image sensor with dual floating diffusions per pixel for flicker-free detection of light emitting diodes

Image sensor with hybrid deep trench isolation

Horizontal avalanche photodiode

Conductive trench isolation

Image sensor with asymmetric-microlens phase-detection auto-focus (PDAF) detectors, associated PDAF imaging system, and associated method

High dynamic range image sensor with virtual high-low sensitivity pixels

Stacked image sensor

Isolation structure in photodiode

High dynamic range image sensor with reduced sensitivity to high intensity light

Image sensor pixel cell with switched deep trench isolation structure

Systems and methods for detecting light-emitting diode without flickering

Big-small pixel scheme for image sensors

Photosensitive capacitor pixel for image sensor

Interconnect layer contact and method for improved packaged integrated circuit reliability

Curved image sensor using thermal plastic substrate material

Biased deep trench isolation

High dynamic range image sensor with reduced sensitivity to high intensity light

Graded-semiconductor image sensor

Image sensor with inverted source follower

Biased deep trench isolation

Color image sensor with metal mesh to detect infrared light

Edge reflection reduction

Color filter array with reference pixel to reduce spectral crosstalk

Method of fabricating multi-wafer image sensor

Color filter array with support structures to provide improved filter thickness uniformity

Negative biased substrate for pixels in stacked image sensors

Conductive trench isolation

Optical shield in a pixel cell planarization layer for black level correction

Pad design for circuit under pad in semiconductor devices

Fully buried color filter array of image sensor

Image sensor with two-dimensional split dual photodiode pairs

Virtual high dynamic range large-small pixel image sensor

Image sensor pixel having storage gate implant with gradient profile

Lateral light shield in backside illuminated imaging sensors

Fully buried color filter array of image sensor

Semiconductor device with buried metal pad, and methods for manufacture

Flip-chip sample imaging devices with self-aligning lid

Apparatus and method for single-photon avalanche-photodiode detectors with reduced dark count rate

Silicon photosensor array integrated circuit on [110]substrate with deep, anisotropically-etched, trench isolation

Sensor comprising gate modulation with inductor to form a resonant circuit

Resonant-filter image sensor and associated fabrication method

Resonant-filter image sensor and associated fabrication method

Edge reflection reduction

Edge reflection reduction

Graded-semiconductor image sensor

Through-semiconductor and through-dielectric isolation structure

Edge reflection reduction

Image sensor with inverted source follower

OmniVision Technologies

Dual pixel-sized color image sensors and methods for manufacturing the same