P

Inventor

FUJII NOBUTOSHI

JP76 patents
⚠️ This page may combine multiple inventors who share the name “FUJII NOBUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SONY CORP

30 patents
US9147650B2Sep 29, 2015

Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus

SONY CORP16 citations92
US9111763B2Aug 18, 2015

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP9 citations92
US8946797B2Feb 3, 2015

Solid-state imaging device, method of manufacturing solid-state imaging device, apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and electronic device

SONY CORP20 citations92
US10608028B2Mar 31, 2020

Image sensor having improved dicing properties

SONY CORP4 citations84
US10485293B2Nov 26, 2019

Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereof

SONY CORP6 citations84
US10431621B2Oct 1, 2019

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP7 citations84
US10236238B2Mar 19, 2019

Semiconductor device

SONY CORP8 citations84
US10038021B2Jul 31, 2018

Packaged image sensor having improved dicing properties

SONY CORP6 citations84
US10038024B2Jul 31, 2018

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP3 citations84
US9991301B2Jun 5, 2018

Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same

SONY CORP8 citations84
US9443802B2Sep 13, 2016

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP7 citations84
US9190275B2Nov 17, 2015

Bonding substrates with electrical connection through insulating film

SONY CORP5 citations84
US10026769B2Jul 17, 2018

Semiconductor device and solid-state imaging device

SONY CORP12 citations83
US11594563B2Feb 28, 2023

Image sensor having improved dicing properties

SONY CORP3 citations73
US11107855B2Aug 31, 2021

Method for bonding and connecting substrates

SONY CORP1 citations73
US11024658B2Jun 1, 2021

Image sensor including grooves

SONY CORP2 citations73
US10985102B2Apr 20, 2021

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP2 citations73
US10707258B2Jul 7, 2020

Semiconductor device with multiple substrates electrically connected through an insulating film

SONY CORP1 citations73
US10431618B2Oct 1, 2019

Stacked lens structure method of manufacturing the same, and electronic apparatus

SONY CORP1 citations73
US10217791B2Feb 26, 2019

Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera

SONY CORP3 citations73
US9911778B2Mar 6, 2018

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP2 citations73
US9716076B2Jul 25, 2017

Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof

SONY CORP2 citations73
US9666627B2May 30, 2017

Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film

SONY CORP2 citations73
US9530687B2Dec 27, 2016

Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera

SONY CORP3 citations73
US9276043B2Mar 1, 2016

Photoelectric conversion device, method of manufacturing photoelectric conversion device, solid-state imaging unit, and electronic apparatus

SONY CORP3 citations73
US11587857B2Feb 21, 2023

Semiconductor device

SONY CORP0 citations63
US10134795B2Nov 20, 2018

Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method

SONY CORP1 citations63
US11569123B2Jan 31, 2023

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

SONY CORP0 citations62
US11342371B2May 24, 2022

Stacked lens structure, method of manufacturing the same, and electronic apparatus

SONY CORP0 citations62
US10804313B2Oct 13, 2020

Semiconductor device and solid-state imaging device

SONY CORP1 citations62

SONY SEMICONDUCTOR SOLUTIONS CORP

15 patents
US11742374B2Aug 29, 2023

Semiconductor device, method of manufacturing semiconductor device, and imaging element

SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US11543621B2Jan 3, 2023

AF module, camera module, and electronic apparatus

SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US11031431B2Jun 8, 2021

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

SONY SEMICONDUCTOR SOLUTIONS CORP5 citations73
US10753551B2Aug 25, 2020

Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate

SONY SEMICONDUCTOR SOLUTIONS CORP4 citations73
US11194135B2Dec 7, 2021

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10991745B2Apr 27, 2021

Semiconductor device, method of manufacturing the same, and electronic apparatus

SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10379323B2Aug 13, 2019

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

SONY SEMICONDUCTOR SOLUTIONS CORP1 citations72
US11130299B2Sep 28, 2021

Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method

SONY SEMICONDUCTOR SOLUTIONS CORP2 citations71
US11262485B2Mar 1, 2022

Image sensor and electronic apparatus

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations63
US12199123B2Jan 14, 2025

Semiconductor device including a structure for higher integration

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11990366B2May 21, 2024

Semiconductor device and method for manufacturing the same, and electronic apparatus

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11769784B2Sep 26, 2023

Imaging device, electronic apparatus, and method of manufacturing imaging device

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11525984B2Dec 13, 2022

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11322538B2May 3, 2022

Imaging device, electronic apparatus, and method of manufacturing imaging device

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11264272B2Mar 1, 2022

Semiconductor device and method for manufacturing the same, and electronic apparatus

SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62

SONY GROUP CORP

2 patents

FUJII NOBUTOSHI

1 patent

KAGAWA YOSHIHISA

1 patent

ULVAC INC

1 patent

Showing the top 50 of 76 patents by PatentIndex Score.