Inventor
FUJII NOBUTOSHI
JP76 patents
⚠️ This page may combine multiple inventors who share the name “FUJII NOBUTOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
30 patentsUS9147650B2Sep 29, 2015
Semiconductor device, method for manufacturing semiconductor device, and electronic apparatus
SONY CORP16 citations92
US9111763B2Aug 18, 2015
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP9 citations92
US8946797B2Feb 3, 2015
Solid-state imaging device, method of manufacturing solid-state imaging device, apparatus for manufacturing semiconductor device, method of manufacturing semiconductor device, and electronic device
SONY CORP20 citations92
US10608028B2Mar 31, 2020
Image sensor having improved dicing properties
SONY CORP4 citations84
US10485293B2Nov 26, 2019
Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereof
SONY CORP6 citations84
US10431621B2Oct 1, 2019
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP7 citations84
US10236238B2Mar 19, 2019
Semiconductor device
SONY CORP8 citations84
US10038021B2Jul 31, 2018
Packaged image sensor having improved dicing properties
SONY CORP6 citations84
US10038024B2Jul 31, 2018
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP3 citations84
US9991301B2Jun 5, 2018
Image sensor having improved dicing properties, manufacturing apparatus, and manufacturing method of the same
SONY CORP8 citations84
US9443802B2Sep 13, 2016
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP7 citations84
US9190275B2Nov 17, 2015
Bonding substrates with electrical connection through insulating film
SONY CORP5 citations84
US10026769B2Jul 17, 2018
Semiconductor device and solid-state imaging device
SONY CORP12 citations83
US11594563B2Feb 28, 2023
Image sensor having improved dicing properties
SONY CORP3 citations73
US11107855B2Aug 31, 2021
Method for bonding and connecting substrates
SONY CORP1 citations73
US11024658B2Jun 1, 2021
Image sensor including grooves
SONY CORP2 citations73
US10985102B2Apr 20, 2021
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP2 citations73
US10707258B2Jul 7, 2020
Semiconductor device with multiple substrates electrically connected through an insulating film
SONY CORP1 citations73
US10431618B2Oct 1, 2019
Stacked lens structure method of manufacturing the same, and electronic apparatus
SONY CORP1 citations73
US10217791B2Feb 26, 2019
Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera
SONY CORP3 citations73
US9911778B2Mar 6, 2018
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP2 citations73
US9716076B2Jul 25, 2017
Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof
SONY CORP2 citations73
US9666627B2May 30, 2017
Electronic apparatus and manufacturing method for an electronic apparatus having multiple substrates directly electrically connected through an insulating film
SONY CORP2 citations73
US9530687B2Dec 27, 2016
Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera
SONY CORP3 citations73
US9276043B2Mar 1, 2016
Photoelectric conversion device, method of manufacturing photoelectric conversion device, solid-state imaging unit, and electronic apparatus
SONY CORP3 citations73
US11587857B2Feb 21, 2023
Semiconductor device
SONY CORP0 citations63
US10134795B2Nov 20, 2018
Semiconductor device with multiple substrates electrically connected through an insulating film and manufacturing method
SONY CORP1 citations63
US11569123B2Jan 31, 2023
Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
SONY CORP0 citations62
US11342371B2May 24, 2022
Stacked lens structure, method of manufacturing the same, and electronic apparatus
SONY CORP0 citations62
US10804313B2Oct 13, 2020
Semiconductor device and solid-state imaging device
SONY CORP1 citations62
SONY SEMICONDUCTOR SOLUTIONS CORP
15 patentsUS11742374B2Aug 29, 2023
Semiconductor device, method of manufacturing semiconductor device, and imaging element
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US11543621B2Jan 3, 2023
AF module, camera module, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US11031431B2Jun 8, 2021
Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP5 citations73
US10753551B2Aug 25, 2020
Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
SONY SEMICONDUCTOR SOLUTIONS CORP4 citations73
US11194135B2Dec 7, 2021
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10991745B2Apr 27, 2021
Semiconductor device, method of manufacturing the same, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10379323B2Aug 13, 2019
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations72
US11130299B2Sep 28, 2021
Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations71
US11262485B2Mar 1, 2022
Image sensor and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations63
US12199123B2Jan 14, 2025
Semiconductor device including a structure for higher integration
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11990366B2May 21, 2024
Semiconductor device and method for manufacturing the same, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11769784B2Sep 26, 2023
Imaging device, electronic apparatus, and method of manufacturing imaging device
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11525984B2Dec 13, 2022
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11322538B2May 3, 2022
Imaging device, electronic apparatus, and method of manufacturing imaging device
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11264272B2Mar 1, 2022
Semiconductor device and method for manufacturing the same, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
SONY GROUP CORP
2 patentsFUJII NOBUTOSHI
1 patentKAGAWA YOSHIHISA
1 patentULVAC INC
1 patentShowing the top 50 of 76 patents by PatentIndex Score.