Inventor
HSIEH YU-SHUN
TW5 patents
Patents
5 patentsUS10312198B2Jun 4, 2019
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG2 citations67
US11462467B2Oct 4, 2022
Lead frame, package structure comprising the same and method for manufacturing the package structure
ADVANCED SEMICONDUCTOR ENG1 citations59
US11139225B2Oct 5, 2021
Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations57
US11450596B2Sep 20, 2022
Lead frame, package structure and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations55
US10797004B2Oct 6, 2020
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations46