Inventor

WU KO-PU

TW2 patents

Patents

2 patents

US11139225B2Oct 5, 2021

Device including a plurality of leads surrounding a die paddle and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations57

US11450596B2Sep 20, 2022

Lead frame, package structure and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations55