Inventor

HUNG KUN-KU

TW2 patents

⚠️ This page may combine multiple inventors who share the name “HUNG KUN-KU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUNG KUN-KU

1 patent

US8277286B2Oct 2, 2012

Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method

HUNG KUN-KU17 citations76

TAIWAN SEMICONDUCTOR MFG

1 patent

US6638868B1Oct 28, 2003

Method for preventing or reducing anodic Cu corrosion during CMP

TAIWAN SEMICONDUCTOR MFG5 citations54