Inventor

TSUGAWA Yuta

JP3 patents

Patents

3 patents

US11497125B2Nov 8, 2022

Bonded substrate, metal circuit board, and circuit board

DENKA COMPANY LTD1 citations57

US11430727B2Aug 30, 2022

Ceramic circuit substrate

DENKA COMPANY LTD0 citations57

US11570890B2Jan 31, 2023

Ceramic circuit board and module using same

DENKA COMPANY LTD1 citations54