Inventor

CHEN YUNG-SHIH

TW3 patents

⚠️ This page may combine multiple inventors who share the name “CHEN YUNG-SHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EXPRESS PACKAGING SYSTEMS INC

1 patent

US5825084AOct 20, 1998

Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

EXPRESS PACKAGING SYSTEMS INC117 citations93

NAT SEMICONDUCTOR CORP

1 patent

US4486511ADec 4, 1984

Solder composition for thin coatings

NAT SEMICONDUCTOR CORP13 citations66

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US12575409B2Mar 10, 2026

Interconnect level with high resistance layer and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60