P

Inventor

KIDWELL JR DONALD WILLIAM

US20 patents

Patents

20 patents
US9263370B2Feb 16, 2016

Semiconductor device with via bar

QUALCOMM INC58 citations97
US10685924B2Jun 16, 2020

Antenna-on-package arrangements

QUALCOMM INC16 citations85
US10734332B2Aug 4, 2020

High aspect ratio interconnects in air gap of antenna package

QUALCOMM INC9 citations83
US10497748B2Dec 3, 2019

Integrated piezoelectric micromechanical ultrasonic transducer pixel and array

QUALCOMM INC9 citations83
US9496213B2Nov 15, 2016

Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate

QUALCOMM INC11 citations82
US10490880B2Nov 26, 2019

Glass-based antenna array package

QUALCOMM INC6 citations73
US11785399B2Oct 10, 2023

Hearable device comprising integrated device and wireless functionality

QUALCOMM INC4 citations72
US9325420B2Apr 26, 2016

Electro-optical transceiver device to enable chip-to-chip interconnection

QUALCOMM INC5 citations72
US11206499B2Dec 21, 2021

Hearable device comprising integrated device and wireless functionality

QUALCOMM INC4 citations71
US10867740B2Dec 15, 2020

Inductor apparatus and method of fabricating

QUALCOMM INC2 citations68
US11620806B2Apr 4, 2023

Optical character detection using a low-power sensor

QUALCOMM INC0 citations62
US10618079B2Apr 14, 2020

Piezoelectric micromechanical ultrasonic transducers and transducer arrays

QUALCOMM INC1 citations62
US10770646B2Sep 8, 2020

Manufacturing method for flexible PMUT array

QUALCOMM INC1 citations61
US9773862B2Sep 26, 2017

High quality factor capacitors and methods for fabricating high quality factor capacitors

QUALCOMM INC0 citations52
US9548350B2Jan 17, 2017

High quality factor capacitors and methods for fabricating high quality factor capacitors

QUALCOMM INC0 citations52
US11411321B2Aug 9, 2022

Broadband antenna system

QUALCOMM INC0 citations51
US10199152B2Feb 5, 2019

Embedded thin film magnetic carrier for integrated voltage regulator

QUALCOMM INC0 citations51
US9105602B2Aug 11, 2015

Embedded three-dimensional capacitor

QUALCOMM INC0 citations51
US10722918B2Jul 28, 2020

Release hole plus contact via for fine pitch ultrasound transducer integration

QUALCOMM INC0 citations50
US10109784B2Oct 23, 2018

Sensor device

QUALCOMM INC1 citations50