Inventor

HSIAO YU-CHANG

TW3 patents

Patents

3 patents

US8722531B1May 13, 2014

Barrier layer for copper interconnect

TAIWAN SEMICONDUCTOR MFG13 citations90

US8872342B2Oct 28, 2014

Barrier layer for copper interconnect

TAIWAN SEMICONDUCTOR MFG4 citations82

US9064934B2Jun 23, 2015

Barrier layer for copper interconnect

TAIWAN SEMICONDUCTOR MFG0 citations50