Inventor
CHUNG KISUP
US20 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG KISUP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS10090378B1Oct 2, 2018
Efficient metal-insulator-metal capacitor
IBM4 citations83
US11476415B2Oct 18, 2022
Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying features
IBM3 citations73
US11075281B2Jul 27, 2021
Additive core subtractive liner for metal cut etch processes
IBM1 citations72
US12457905B2Oct 28, 2025
Patterning magnetic tunnel junctions and the like while reducing detrimental resputtering of underlying features
IBM0 citations62
US11990342B2May 21, 2024
Metal cut patterning and etching to minimize interlayer dielectric layer loss
IBM0 citations62
US11276767B2Mar 15, 2022
Additive core subtractive liner for metal cut etch processes
IBM0 citations62
US11152489B2Oct 19, 2021
Additive core subtractive liner for metal cut etch processes
IBM0 citations62
US11133189B2Sep 28, 2021
Metal cut patterning and etching to minimize interlayer dielectric layer loss
IBM0 citations62
US10748962B2Aug 18, 2020
Method and structure for forming MRAM device
IBM0 citations52
US10734234B2Aug 4, 2020
Metal cut patterning and etching to minimize interlayer dielectric layer loss
IBM0 citations52
US9881842B1Jan 30, 2018
Wimpy and nominal semiconductor device structures for vertical finFETs
IBM1 citations52
US10714683B2Jul 14, 2020
Multilayer hardmask for high performance MRAM devices
IBM0 citations51
US10680169B2Jun 9, 2020
Multilayer hardmask for high performance MRAM devices
IBM0 citations51
US10600884B2Mar 24, 2020
Additive core subtractive liner for metal cut etch processes
IBM0 citations51
US10256289B2Apr 9, 2019
Efficient metal-insulator-metal capacitor fabrication
IBM0 citations51
US10693059B2Jun 23, 2020
MTJ stack etch using IBE to achieve vertical profile
IBM0 citations42