Inventor
LAI SIAW KANG
MY7 patents
⚠️ This page may combine multiple inventors who share the name “LAI SIAW KANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
3 patentsUS11164847B2Nov 2, 2021
Methods and apparatus for managing thermal behavior in multichip packages
INTEL CORP2 citations68
US11658159B2May 23, 2023
Methods and apparatus for managing thermal behavior in multichip packages
INTEL CORP0 citations58
US9390039B2Jul 12, 2016
Providing a fine-grained arbitration system
INTEL CORP0 citations48