Inventor
MATSUGAI HIROYASU
JP26 patents
⚠️ This page may combine multiple inventors who share the name “MATSUGAI HIROYASU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY SEMICONDUCTOR SOLUTIONS CORP
12 patentsUS11574949B2Feb 7, 2023
Camera package, manufacturing method of camera package, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP4 citations74
US11543621B2Jan 3, 2023
AF module, camera module, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations73
US11194135B2Dec 7, 2021
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations72
US10379323B2Aug 13, 2019
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations72
US11130299B2Sep 28, 2021
Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method
SONY SEMICONDUCTOR SOLUTIONS CORP2 citations71
US12132064B2Oct 29, 2024
Camera package, method for manufacturing camera package, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US11525984B2Dec 13, 2022
Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations62
US10627549B2Apr 21, 2020
Stacked lens structure, method of manufacturing the same, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP1 citations62
US10866345B2Dec 15, 2020
Laminated lens structure, camera module, and method for manufacturing laminated lens structure
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations52
US10690814B2Jun 23, 2020
Lens substrate, semiconductor device, and electronic apparatus
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations52
US10534162B2Jan 14, 2020
Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations51
US10712543B2Jul 14, 2020
Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations40
SONY CORP
10 patentsUS9842879B2Dec 12, 2017
Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
SONY CORP7 citations83
US10431618B2Oct 1, 2019
Stacked lens structure method of manufacturing the same, and electronic apparatus
SONY CORP1 citations73
US9941321B2Apr 10, 2018
Semiconductor device and method of manufacturing semiconductor device
SONY CORP2 citations73
US10854667B2Dec 1, 2020
Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
SONY CORP4 citations72
US10355042B2Jul 16, 2019
Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatus
SONY CORP4 citations72
US11342371B2May 24, 2022
Stacked lens structure, method of manufacturing the same, and electronic apparatus
SONY CORP0 citations62
US8384173B2Feb 26, 2013
Solid-state imaging device and method for making the same, and imaging apparatus
SONY CORP3 citations62
US10818717B2Oct 27, 2020
Stacked lens structure, method of manufacturing the same, and electronic apparatus
SONY CORP0 citations52
US9111828B2Aug 18, 2015
Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatus
SONY CORP0 citations52
US8867581B2Oct 21, 2014
Semiconductor laser and method of manufacturing the same
SONY CORP0 citations48
MATSUGAI HIROYASU
2 patentsUS9472472B2Oct 18, 2016
Semiconductor device and method of manufacturing semiconductor device
MATSUGAI HIROYASU6 citations82
US8859391B2Oct 14, 2014
Semiconductor device, method for manufacturing semiconductor device, method for laminating semiconductor wafers, and electronic device
MATSUGAI HIROYASU7 citations81