Inventor

TAZAWA HIROSHI

JP42 patents

⚠️ This page may combine multiple inventors who share the name “TAZAWA HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAZAWA HIROSHI

TOSHIBA KK

Flip-chip connection type semiconductor integrated circuit device

Semiconductor assembly having laminated semiconductor devices

Flip chip mounting type semiconductor device

Tape carrier and assembly structure thereof

Semiconductor device having a bump electrode connected to an inner lead

Semiconductor device, method of fabricating the same and copper leads

Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics

Semiconductor device using gold bumps and copper leads as bonding elements

Semiconductor assembly having laminated semiconductor devices

Semiconductor device using film carrier

Ic packing device

Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads

Method and apparatus for controlling bonding load of fine lead electrode

SONY SEMICONDUCTOR SOLUTIONS CORP

AF module, camera module, and electronic apparatus

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and method

Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing method

Stacked lens structure, method of manufacturing the same, and electronic apparatus

Lens substrate, semiconductor device, and electronic apparatus

Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic device

Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrate

SONY CORP

Stacked lens structure method of manufacturing the same, and electronic apparatus

Transfer mold and manufacturing method for structure

Stacked lens structure, method of manufacturing the same, and electronic apparatus

Display apparatus

Stacked lens structure, method of manufacturing the same, and electronic apparatus

Optical unit, imaging device, electronic apparatus, and master

Conductive element and method of manufacturing the same, wiring element, and master copy

DEXERIALS CORP

Anti-reflection structure, base material with anti-reflection structure, camera module and information terminal device

Master, transferred object, and method of producing master

Resin laminated optical body and method for manufacturing the same

Laminate, method of producing laminate, method of forming optical body, and camera module-equipped device

Concave-convex structure, optical member, and electronic apparatus

Optical filter and light-emitting device

Optical device having fluid-filled partitioned spaces with electric field control material

TAZAWA HIROSHI

Optical element, method for producing the same, and display apparatus

Pattern substrate, method of producing the same, information input apparatus, and display apparatus

Transparent conductive element, information input apparatus, and display apparatus

HAYASHIBE KAZUYA

Optical element, optical system, imaging apparatus, optical instrument, and stamper

KURIYAMA AKITO

Retardation film, method of producing the same and display device

TAKAHASHI HIDETOSHI

Optical element and method for manufacturing optical element