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Inventor
LEE CHAN SUN
KR
4 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHAN SUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HYNIX SEMICONDUCTOR INC
2 patents
US7652362B2
Jan 26, 2010
Semiconductor package stack with through-via connection
HYNIX SEMICONDUCTOR INC
16 citations
77
US8024857B2
Sep 27, 2011
Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same
HYNIX SEMICONDUCTOR INC
3 citations
54
SK HYNIX INC
2 patents
US11735559B2
Aug 22, 2023
Semiconductor packages and manufacturing methods for the same
SK HYNIX INC
0 citations
56
US11437342B2
Sep 6, 2022
Semiconductor packages and manufacturing methods for the same
SK HYNIX INC
0 citations
56