Inventor
DALMIA SIDHARTH
US51 patents
⚠️ This page may combine multiple inventors who share the name “DALMIA SIDHARTH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
22 patentsUS11424539B2Aug 23, 2022
Wireless communication technology, apparatuses, and methods
INTEL CORP71 citations96
US10566298B2Feb 18, 2020
Package on antenna package
INTEL CORP20 citations91
US11955732B2Apr 9, 2024
Wireless communication technology, apparatuses, and methods
INTEL CORP7 citations84
US10797394B2Oct 6, 2020
Antenna modules and communication devices
INTEL CORP8 citations83
US11509037B2Nov 22, 2022
Integrated circuit packages, antenna modules, and communication devices
INTEL CORP3 citations73
US11664596B2May 30, 2023
Antenna modules and communication devices
INTEL CORP2 citations72
US11121468B2Sep 14, 2021
Antenna modules and communication devices
INTEL CORP1 citations72
US11937367B2Mar 19, 2024
Radio frequency front-end structures
INTEL CORP2 citations68
US12068525B2Aug 20, 2024
Integrated circuit packages, antenna modules, and communication devices
INTEL CORP1 citations62
US11616283B2Mar 28, 2023
5G mmWave antenna architecture with thermal management
INTEL CORP0 citations62
US11469190B2Oct 11, 2022
Parasitic-aware integrated substrate balanced filter and apparatus to achieve transmission zeros
INTEL CORP0 citations62
US11024574B2Jun 1, 2021
Integrated substrate communication frontend
INTEL CORP0 citations62
US12237589B2Feb 25, 2025
Wireless communication technology, apparatuses, and methods
INTEL CORP0 citations61
US12218408B2Feb 4, 2025
Antenna boards and communication devices
INTEL CORP0 citations61
US12255382B2Mar 18, 2025
Antenna modules and communication devices
INTEL CORP0 citations60
US11870132B2Jan 9, 2024
Antenna modules and communication devices
INTEL CORP0 citations60
US11374322B2Jun 28, 2022
Perpendicular end fire antennas
INTEL CORP1 citations60
US11233018B2Jan 25, 2022
Package on antenna package
INTEL CORP0 citations60
US12200855B2Jan 14, 2025
Radio frequency front-end structures
INTEL CORP0 citations58
US11729902B2Aug 15, 2023
Radio frequency front-end structures
INTEL CORP0 citations58
US11282633B2Mar 22, 2022
Device with out-plane inductors
INTEL CORP0 citations52
US11596055B2Feb 28, 2023
Apparatus and system of a printed circuit board (PCB) including a radio frequency (RF) transition
INTEL CORP0 citations51
INTEL IP CORP
9 patentsUS11011827B2May 18, 2021
Antenna boards and communication devices
INTEL IP CORP17 citations93
US10741932B2Aug 11, 2020
Compact radio frequency (RF) communication modules with endfire and broadside antennas
INTEL IP CORP28 citations89
US10186756B2Jan 22, 2019
Antennas in electronic devices
INTEL IP CORP8 citations84
US11380979B2Jul 5, 2022
Antenna modules and communication devices
INTEL IP CORP8 citations83
US10756033B2Aug 25, 2020
Wireless module with antenna package and cap package
INTEL IP CORP9 citations83
US10049961B1Aug 14, 2018
Partially molded direct chip attach package structures for connectivity module solutions
INTEL IP CORP13 citations82
US11336015B2May 17, 2022
Antenna boards and communication devices
INTEL IP CORP2 citations73
US10332821B2Jun 25, 2019
Partially molded direct chip attach package structures for connectivity module solutions
INTEL IP CORP2 citations71
US11855353B2Dec 26, 2023
Compact radio frequency (RF) communication modules with endfire and broadside antennas
INTEL IP CORP0 citations58
GEORGIA TECH RES INST
8 patentsUS7795995B2Sep 14, 2010
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
GEORGIA TECH RES INST62 citations97
US6900708B2May 31, 2005
Integrated passive devices fabricated utilizing multi-layer, organic laminates
GEORGIA TECH RES INST79 citations97
US6987307B2Jan 17, 2006
Stand-alone organic-based passive devices
GEORGIA TECH RES INST58 citations96
US8013688B2Sep 6, 2011
Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
GEORGIA TECH RES INST24 citations92
US7260890B2Aug 28, 2007
Methods for fabricating three-dimensional all organic interconnect structures
GEORGIA TECH RES INST35 citations92
US7068124B2Jun 27, 2006
Integrated passive devices fabricated utilizing multi-layer, organic laminates
GEORGIA TECH RES INST39 citations92
US7489914B2Feb 10, 2009
Multi-band RF transceiver with passive reuse in organic substrates
GEORGIA TECH RES INST48 citations90
US7805834B2Oct 5, 2010
Method for fabricating three-dimensional all organic interconnect structures
GEORGIA TECH RES INST10 citations84
AVX CORP
3 patentsUS8345433B2Jan 1, 2013
Heterogeneous organic laminate stack ups for high frequency applications
AVX CORP25 citations92
US7989895B2Aug 2, 2011
Integration using package stacking with multi-layer organic substrates
AVX CORP15 citations84
US7808434B2Oct 5, 2010
Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
AVX CORP18 citations84
DALMIA SIDHARTH
3 patentsTYCO ELECTRONICS CORP
2 patentsHARRISON WILLIAM LEE
1 patentTYCO ELECTRONICS SERVICES GMBH
1 patentJACKET MICRO DEVICES INC
1 patentShowing the top 50 of 51 patents by PatentIndex Score.