Inventor
IWASAKI NORIKI
JP5 patents
Patents
5 patentsUS5197650AMar 30, 1993
Die bonding apparatus
SHARP KK80 citations92
US5173147ADec 22, 1992
Apparatus for sealing a semiconductor package having frosted quartz glass piece and UV light source
SHARP KK12 citations70
US6520844B2Feb 18, 2003
Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
SHARP KK8 citations69
US6582223B2Jun 24, 2003
Pickup apparatus for semiconductor chips
SHARP KK7 citations67
US6984586B2Jan 10, 2006
Method of thinning semiconductor wafer capable of preventing its front from being contaminated and back grinding device for semiconductor wafers
SHARP KK0 citations48