Inventor

CHUNG CHI-WEI

TW2 patents

Patents

2 patents

US6946397B2Sep 20, 2005

Chemical mechanical polishing process with reduced defects in a copper process

TAIWAN SEMICONDUCTOR MFG18 citations82

US6686284B2Feb 3, 2004

Chemical mechanical polisher equipped with chilled retaining ring and method of using

TAIWAN SEMICONDUCTOR MFG8 citations71